SPI - Solder Paste Inspection

Solução completa automática para Inspeção 3D de pasta de solda e PCB’s

ADVANCED 3D SOLDER PASTE INSPECTION (SPI)

Revolutionary high speed 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from printer. Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields.

ADVANCED 3D OPTICAL INSPECTION (AOI)

Award-winning V510i 3D AOI Solution is designed specifically for the PCB manufacturing process. Equipped with high-resolution technology and AI-powered capabilities, the V510i 3D AOI Solution excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance.

ADVANCED 3D X-RAY INSPECTION (AXI)

Award-winning V810i 3D AXI Solution is designed specifically for the PCB manufacturing process. The V810i S3 system with dual lane solution is the pioneer 3D AXI in the market, achieving high throughput with up to ~50% faster cycle time while the regular version speeds up ~20-30% compared to its successor. Equipped with high-resolution X-ray imaging technology and AI capabilities, the V810i 3D AXI Solution excels in hidden defect detection through comprehensive test coverage, high accuracy and high-speed performance.

ADVANCED ROBOTIC VISION (ARV)

Award-winning V9i ARV Solution designed to cater for the PCB manufacturing process. The cost-effective V9i CI system provides fast, reliable and full coverage inspection for conformal coating with high-resolution inspection results. Integrated with 6-axis COBOT arm, V9i ARV Solution provide multi-angle inspection up to 90° for various inspection requirements. Equipped with UV lighting and white light to inspet the conformal coating after curing. With the latest extended size capability (XL), the V9i CI system now capable to support large board inspection with extended size capabilities.